Rumors about the new Kirin 970 chipset by Huawei’s subsidiary HiSilicon are gaining speed. Latest reports reveal TSMC is starting mass production of the 10 nm SoC in September and will provide the chips in time for the Mate 10, anticipated to launch in October.
The successor of the Kirin 960 will keep the Cortex A73 CPU architecture. An improvement is expected with the GPU, which is said to feature 12 cores. That way HiSilicon is aiming to put the 970 on par with the Exynos 8895 and the Snapdragon 835.
The Mate 10 is going to be the first phone with the new chip and also be the first Huawei device with edge-to-edge 18:9 Full Active screen. The LCD itself should measure 6” and offer 2160 x 1080 pixel resolution.